Mechanical Engineering Research

Various research from Mechanical Engineering

Areas of Research Conducted by our Faculty

Research Facilities

Current Funded Research

Design and Manufacturing

Changhong Ke

  • Exploiting Nanoscale Interfaces to Enhance Bulk Mechanical Response of Additively Manufactured Boron Nitride Nanotube-Metal Composites – National Science Foundation

SB Park

  • ACORN (Air-deployable Cost-effective Organic Radiation Nodes) - General Electric Global Research
  • Evaluation of TGV Thermo-Mechanical Behavior by Micro DIC – Corning Incorporated
  • Development of Closed-Loop Control and Optimization Modules of the Printed Circuit Board Assembly Processes in Surface Mount Technology - Koh Young Technology Incorporated
  • Development of Self-Optimization and AI-based Diagnostics Modules in the Printed Circuit Board Assembly Process - Koh Young Technology Incorporated

Bahgat Sammakia

  • SRC CHIRP: Design, Fabrication, and Testing of Metal Porous Media for Thermal Capacitor and Immersion Cooling Applications - Purdue University

Bahgat Sammakia (PI), Scott Schiffres, SB Park (co-PI’s)

  • Radiation-Hard Microelectronics Workforce Development Consortium – Purdue University

Bahgat Sammakia (PI), Scott Schiffres, SB Park, Srikanth Rangarajan (co-PI’s)

  • Design, Develop and Demonstrate a True 3D Packaging - SUNY Applied Materials Research Institute

Scott Schiffres

  • I-Corps: Additive Laser Metal Deposition onto Sillicon for Enhanced Electronics Cooling – National Science Foundation
  • CAREER: Intermetallic Interfacial Thermal Transport for Advanced Electronics Manufacturing - National Science Foundation

Scott Schiffres (PI), Bahgat Sammakia, Changhong Ke (co-PI’s)

  • PFI-TTT: Enhanced Electronic Cooling via 3D Printing from Additive Laser Fabrication of Heat Removal Devices – National Science Foundation

Scott Sciffres (PI), Bahgat Sammakia, SB Park (Co-PI’s)

  • CHIRP: Minimizing Thermal Interfacial Resistance in Heterogeneous Integrated Integration (HI): A Benchmarking Study and Production Tool (Proposal Number W32613) – Purdue University

Pu Zhang

  • Polymer-Based Conformal Space Radiation Shield with Thermal Management Manufactured by Five-Axis 3D Printing Platform - Advanced Cooling Technologies

ADDITIONAL INFORMATION

Dynamic Systems

Ronald Miles (PI), Changhong Ke (Co-PI)

  • Capacitive Pressure/ Velocity Probe for Acoustic Measurements in the Human Ear Canal - National Inst on Deafness & Other Comm Disorders

Sherry Towfighian (PI)

  • MEMS High Voltage Triboelectric Levitation: A Generactuator - National Science Foundation
  • Self-Powered Load Sensors for Total Knee Replacement Health Monitoring - The National Institute of Arthritis and Musculoskeletal and Skin Diseases

Mark Poliks (PI), Shahrzad Towfighian (Co-PI)

  • Soft Electronic Skin-Innervated Robotic Work for Rapid Maintenance of Strategic Assets (Sensiworm), SEMI-Flex Tech

Kaiyan Yu (PI)

  • CAREER: Simultaneous and Independent Control of Nanostructured Objects Through the Use of Coupled External Electric Fields - National Science Foundation

Additional Information

Materials

Junghyun Cho

  • Electronic Assembly Solder Alloy Development - University Instruments Corp.
  • PDRD Conformal Coating Tin Whiskers - Honeywell Federal Manufacturing & Technologies LLC
  • Mechanistic Understanding of the Cu/Oxide Hybrid Bonding - SUNY-IBM Artificial Intelligence Research Alliance Program

Guangwen Zhou

  • Collaborative Research: Coordinated In-Situ Dynamic Experiments and Atomistic Modeling of Surface Segregation in Alloys- National Science Foundation
  • In Situ Visualization and Theoretical Modeling of Early Stages of Oxidation of Metals and Alloys - US Department of Energy.
  • Design, Synthesis and Assembly of Biomimetic Materials with Novel Functionality - Pacific Northwest National Laboratory

Additional Information

Solid Mechanics

Changhong Ke

  • Numerical Simulation of Spray Deposited Electrolyte Layer for Proton Conducting Fuel Cells - Board of Regents of the University of Nebraska
  • Exploiting Nanoscale Interfaces to Enhance Bulk Mechanical Response of Additively Manufactured Boron Nitride Nanotube-Metal Composites – National Science Foundation

SB Park

  • ACORN (Air-deployable Cost-effective Organic Radiation Nodes) - General Electric Global Research
  • Evaluation of TGV Thermo-Mechanical Behavior by Micro DIC – Corning Incorporated
  • AI-based System Integration for Process Enhancement in the Printed Circuit Board Assembly - Koh Young Technology Incorporated
  • Investigation of Warpage for 2.5D and Heterogeneously Integrated Package and Its Assemblies - Google LLC

Mir Jalil Razavi

  • Mechanics of the Formation of Cortical Folding Patterns in the Developing Human Brain - National Science Foundation

Pu Zhang

  • Polymer-Based Conformal Space Radiation Shield with Thermal Management Manufactured by Five-Axis 3D Printing Platform - Advanced Cooling Technologies
  • CAREER: Electro-Mechanical Behaviors of Soft Conductive Composites Embedded with Liquid Metal Fiber Networks - National Science Foundation

ADDITIONAL INFORMATION

Transport Phenomena and Energy

Paul Chiarot

  • Conformal Polymeric Thin Films Manufactoring Using Electrospray Printing - Purdue University - SRC CHIRP
  • Additive Manufacturing using Electrospray Printing of Nanoparticle Inks – National Science Foundation - NSF CAREER

Bahgat Sammakia

  • Design, Fabrication, and Testing of Metal Porous Media for Thermal Capacitor and Immersion Cooling Applications - Purdue University SRC CHIRP
  • Machine Learning-Based Server Thermal Transient Characterizations/Modeling and Feedback Controls - Google LLC

Bahgat Sammakia (PI), Scott Schiffres, SB Park (co-PI’s)

  • Radiation-Hard Microelectronics Workforce Development Consortium Subagreement No. 13000844-021 – Purdue University

Bahgat Sammakia (PI), Scott Schiffres, SB Park, Srikanth Rangarajan (co-PI’s)

  • Design, Develop and Demonstrate a True 3D Packaging - SUNY Applied Materials Research Institute

Scott Schiffres

  • I-Corps: Additive Laser Metal Deposition onto Sillicon for Enhanced Electronics Cooling – National Science Foundation
  • Intermetallic Interfacial Thermal Transport for Advanced Electronics Manufacturing - National Science Foundation CAREER

Scott Schiffres (PI), Bahgat Sammakia, Changhong Ke (co-PI’s)

  • PFI-TTT: Enhanced Electronic Cooling via 3D Printing from Additive Laser Fabrication of Heat Removal Devices – National Science Foundation

Scott Sciffres (PI), Guangwen Zhou, Srikanth Rangarajan (Co-PI’s)

  • Novel In-situ Thermal Property Mapping to Study Powder Feedstock Aging and Laser Powder Bed Fusion

Xin Yong

  • Understanding "wild-type" nanoplastic uptake in single microalgae cells with florescense tracking and computational modeling – National Science Foundation

Xin Yong (PI), Paul Chiarot, Peter Huang (Co-PI's)

  • Capillary-Assisted Printing of Structured Colloidal Monolayers - National Science Foundation

Additional Information

Related Research Centers